Development of zinc physical vapor deposition line.
نویسندگان
چکیده
منابع مشابه
Ti-Cr-N Coatings Deposited by Physical Vapor Deposition on AISI D6 Tool Steels
In this study, physical vapor deposition (PVD) Ti-Cr-N coatings were deposited at two different temperatures 100 and 400ºC on hardened and tempered tool steel substrates. The influence of the applied deposition temperature on the physical and mechanical properties of coatings such as roughness, thickness, phase composition, hardness and Young’s modulus were evaluated. Phase compositions were st...
متن کاملControllable growth of aluminum nanorods using physical vapor deposition
This letter proposes and experimentally demonstrates that oxygen, through action as a surfactant, enables the growth of aluminum nanorods using physical vapor deposition. Based on the mechanism through which oxygen acts, the authors show that the diameter of aluminum nanorods can be controlled from 50 to 500 nm by varying the amount of oxygen present, through modulating the vacuum level, and by...
متن کاملIonized physical vapor deposition of integrated circuit interconnects*
Interconnects, once the technological backwater of integrated circuit technology, now dominate integrated circuit cost and performance. As much as 90 percent of the signal delay time in future integrated circuit designs will be due to the interconnection of semiconductor devices while the remaining 10 percent is due to transistor-related delay. This shifts the thrust of critical research toward...
متن کاملGrowth of Y-shaped nanorods through physical vapor deposition.
This work presents a proposed mechanism for fabricating Y-shaped nanorods, demonstrates the feasibility of the proposal through classical molecular dynamics simulations, and validates the simulations through magnetron sputter deposition experiments. The proposed mechanism relies primarily on the formation of stacking faults during deposition and to a lesser degree on diffusion kinetics and geom...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: SHINKU
سال: 1987
ISSN: 0559-8516,1880-9413
DOI: 10.3131/jvsj.30.775